Unibond electrodes are used for parallel gap bonding and reflow soldering. Molybdenum Unibond electrodes are used for bonding conductive or soft materials such as copper or gold. The face of a Unibond electrode is 0.020 inches (0.5 mm) wide by 0.030 inches (0.75 mm) deep. In unfixtured applications, this limits their use to bonding ribbons (wire) which are at least 0.010 inches (0.25 mm) wide because of the limited visibility.
Model Material Length Width Depth Length
EU2030M Copper Clad Moly 1.125" 020 .030 .080
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